specifications and information are subject to change wit hout notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com, www.triquint.com page 1 of 4 march 2008 scg002 ingap hbt gain block product features ? dc ? 6 ghz ? 21 db gain @ 1 ghz ? +15.5 dbm p1db @ 1 ghz ? +29 dbm oip3 @ 1 ghz ? 3.8 db noise figure ? internally matched to 50 ? lead-free/green/rohs-compliant sot-89 package applications ? mobile infrastructure ? catv / fttx ? wlan / ism ? rfid ? wimax / wibro product description the scg002 is a general-purpose buffer amplifier th at offers high dynamic range in a low-cost surface-mou nt package. at 1000 mhz, the scg002 typically provides 21 db of gain, +29 dbm output ip3, and +15.5 dbm p1db. the scg002 consists of a darlington-pair amplifier using the high reliability ingap/gaas hbt process technol ogy and only requires dc-blocking capacitors, a bias re sistor, and an inductive rf choke for operation. the devic e is ideal for wireless applications and is housed in a lead- free/green/rohs-compliant sot-89 smt package. all devices are 100% rf and dc tested. the broadband mmic amplifier can be directly applie d to various current and next generation wireless techno logies such as gprs, gsm, cdma, and w-cdma. in addition, the scg002 will work for other various applications within the dc to 6 ghz frequency range such as catv and mobile wireless. functional diagram rf in gnd rf out gnd 1 2 3 4 function pin no. input 1 output/bias 3 ground 2, 4 specifications (1) parameter units min typ max operational bandwidth mhz dc 6000 test frequency mhz 1000 gain db 21 output p1db dbm +15.5 output ip3 (2) dbm +29 test frequency mhz 2000 gain db 19 20 input return loss db 14 output return loss db 20 output p1db dbm +15 output ip3 (2) dbm +29 noise figure db 3.8 device voltage v 3.5 3.9 4.3 device current ma 45 1. test conditions unless otherwise noted: 25 oc, supply voltage = +5 v, rbias = 24 , 50 system. 2. 3oip measured with two tones at an output power of +2 db m/tone separated by 1 mhz. the suppression on the largest im3 product is used to calculate t he 3oip using a 2:1 rule. absolute maximum rating parameter rating storage temperature -55 to +150 c device current 150 ma rf input power (continuous) +12 dbm thermal resistance, rth 131 c/w junction temperature +160 c operation of this device above any of these parameters ma y cause permanent damage. typical performance (1) parameter units typical frequency mhz 500 900 1900 2140 s21 db 21.6 21 20.5 19.7 s11 db -17 -17 -15 -14.5 s22 db -18 -18 -21 -21 output p1db dbm +15.8 +15.5 +15 +14.9 output ip3 (2) dbm +28 +29 +29 +29 noise figure db 3.8 3.7 3.8 3.8 ordering information part no. description scg002b-g ingap hbt gain block (lead-free/green/rohs-compliant sot-89 package) SCG002B-PCB 700 ?2400 mhz fully assembled eval. boa rd standard tape / reel size = 1000 pieces on a 7? reel
specifications and information are subject to chang e without notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com, www.triquint.com page 2 of 4 march 2008 scg002 ingap hbt gain block typical device rf performance supply bias = +5 v, r bias = 24 ? , i cc = 45 ma frequency mhz 100 500 900 1900 2140 2400 3500 5800 s21 db 22 21.6 21 20.5 19.7 19.2 17.4 14.3 s11 db -18 -17 -16 -15 -15 -15 -16 -19 s22 db -16.7 -17 -18 -20 -21 -22 -35 -16 output p1db dbm +15.4 +15.6 +15.5 +15 +15 +15 +14.5 +11 output ip3 dbm +28 +28 +29 +29 +29 +29 noise figure db 3.9 3.8 3.8 3.8 3.8 3.9 1. test conditions: t = 25 oc, supply voltage = +5 v, devic e voltage = +3.9 v, rbias = 24 , icc = 45 ma typical, 50 system. 2. 3oip measured with two tones at an output power of -1 dbm/tone separated by 1 mhz. the suppression on the largest im3 product is used to calculate the 3oip using a 2:1 rule. 3. data is shown as device performance only. actual imp lementation for the desired frequency band will be determi ned by external components shown in the application circu it. gain vs. frequency 12 14 16 18 20 22 500 1000 1500 2000 2500 3000 frequency (mhz) gain (db) +25c -40c +85c s11, s22 vs. frequency -40 -35 -30 -25 -20 -15 -10 -5 0 0 1 2 3 4 5 6 frequency (ghz) s11, s22 (db) s22 s11 vde vs. icc 0 20 40 60 80 100 120 0.0 1.0 2.0 3.0 4.0 5.0 vde (v) icc (ma) +25c oip3 vs. frequency 24 26 28 30 32 500 1000 1500 2000 2500 3000 frequency (mhz) oip3 (dbm) +25c -40c +85c noise figure vs. frequency 2 2.5 3 3.5 4 4.5 500 1000 1500 2000 frequency (mhz) nf (db) p1db vs. frequency 10 12 14 16 18 20 500 1000 1500 2000 2500 3000 frequency (mhz) p1db (dbm) +25c -40c +85c typical device s-parameters s-parameters (v device = +3.9 v, i cc = 45 ma, t = 25 c, calibrated to device leads) freq (mhz) s11 (db) s11 (ang) s21 (db) s21 (ang) s12 (db) s12 (ang) s22 (db) s22 (ang) 50 -33.66 160.38 22.12 177.97 -23.51 -0.74 -42.92 - 10.61 500 -25.70 57.47 21.92 160.79 -23.66 0.45 -25.55 -5 9.74 1000 -22.88 73.66 21.40 142.72 -23.41 0.69 -22.04 - 132.34 1500 -20.95 88.39 20.67 126.57 -23.49 1.82 -16.66 - 164.52 2000 -21.62 77.79 19.85 111.46 -23.03 2.10 -14.30 - 178.04 2500 -22.23 25.60 19.15 99.29 -23.10 1.10 -15.12 -1 77.70 3000 -21.00 16.65 18.29 86.85 -22.58 2.16 -13.92 17 0.72 3500 -20.58 10.75 17.55 74.67 -22.06 0.98 -12.97 15 3.21 4000 -22.29 4.19 16.72 62.69 -21.59 -1.56 -11.90 13 7.74 4500 -24.96 19.24 15.98 51.73 -20.86 -5.93 -10.64 1 26.68 5000 -38.73 11.58 15.29 41.78 -20.66 -8.63 -9.87 12 1.15 5500 -27.75 -158.73 14.67 32.60 -19.86 -10.67 -10.0 3 119.72 6000 -22.85 -167.85 14.12 23.12 -19.66 -12.11 -10.6 8 122.34 device s-parameters are available for download from the website at: http://www.wj.com
specifications and information are subject to chang e without notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com, www.triquint.com page 3 of 4 march 2008 scg002 ingap hbt gain block recommended application circuit SCG002B-PCB recommended component values reference frequency (mhz) designator 50 500 900 1900 2200 2500 3500 l1 820 nh 220 nh 68 nh 27 nh 22 nh 18 nh 15 nh c1, c2, c4 .018 f 1000 pf 100 pf 68 pf 68 pf 56 pf 39 pf 1. the proper values for the components are dependent upon the intended frequency of operation. 2. the following values are contained on the evaluation board to achieve optimal broadband performance: ref. desig. value / type size l1 39 nh wirewound inductor 0603 c1, c2 56 pf chip capacitor 0603 c3 0.018 f chip capacitor 0603 c4 do not place r4 24 1% tolerance 0805 recommended bias resistor values supply voltage r1 value size 5 v 24.4 ohms 0805 6 v 46.7 ohms 0805 8 v 91 ohms 1210 9 v 113 ohms 1210 10 v 136 ohms 2010 12 v 180 ohms 2010 the proper value for r1 is dependent upon the supply voltage and allows for bias stability over temperature. wj recommends a minimum supply bias of +5 v. a 1% tolerance resistor is recommended. c1 blocking capacitor rf out l1 rf choke c3 0.018 f r4 bias resistor rf in c4 bypass capacitor c2 blocking capacitor vcc icc = 45 ma scg002b
specifications and information are subject to chang e without notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com, www.triquint.com page 4 of 4 march 2008 scg002 ingap hbt gain block scg002b-g mechanical information this package is lead-free/green/rohs-compliant. th e plating material on the leads is nipdau. it is c ompatible with both lead-free (maximum 260 c reflow temperature) and leaded (maximum 245 c reflow temperature) soldering processes. outline drawing land pattern product marking the component will be marked with an ?s002g? designator with an alphanumeric lot code on the top surface of the package. the obsolete tin-lead package is marked with an ?s002? designator followed by an alphanumeric lot code. tape and reel specifications for this part are located on the website in the ?application notes? section. msl / esd rating esd rating: class 1a value: passes between 250 and 500v test: human body model (hbm) standard: jedec standard jesd22-a114 msl rating: level 3 at +260 c convection reflow standard: jedec standard j-std-020 mounting config. notes 1. ground / thermal vias are critical for the proper perf ormance of this device. vias should use a .35mm (#80 / .0135?) diameter drill and have a final plated thru diameter of .25 mm (.010?). 2. add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. mounting screws can be added near the part to fasten the board to a heatsink. ensure that the ground / thermal via regi on contacts the heatsink. 4. do not put solder mask on the backside of the pc boar d in the region where the board contacts the heatsink. 5. rf trace width depends upon the pc board material and construction. 6. use 1 oz. copper minimum. 7. all dimensions are in millimeters (inches). angle s are in degrees. s002g xxxx-x
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